Job Category: Manufacturing Degree Level: Technical / Trade Job Description: Job Summary: A Diebond (or Die Attach) Assembly Process Technician in the semiconductor industr…
Job Category: Manufacturing Degree Level: Associates / College (APAC) Job Description: Conducts technical training courses for employees in the use of complex situations for …
Job Category: Operator Degree Level: Associates / College (APAC) Job Description: Job Summary: To operate Production equipment and (or) work in certain positions to achieve…
Job Category: Operator Degree Level: Associates / College (APAC) Job Description: Job Summary: To operate Production equipment and (or) work in certain positions to achieve…
Job Category: Engineering Degree Level: Bachelors Job Description: A Senior Wire Bond Process Engineer optimizes, sustains, and develops ultrasonic wire bonding processes to …
Job Category: Engineering, Manufacturing Degree Level: Bachelors Job Description: 1. Receives incoming raw materials such as wafers and leadframes (new and current) ● Receiv…
Job Category: Intern Degree Level: Associates / College (APAC) Job Description: RESPONSIBILITIES: Assist in monitoring and recording raw water and wastewater quality parame…
Job Category: Engineering Degree Level: Bachelors Job Description: Job Summary: Maintain and support equipment readiness Typically performs one or more of the following in …
Job Category: Engineering Degree Level: Bachelors Job Description: Job Summary: onsemi is currently seeking a hands-on Process Engineer. This person will utilize innovati…