Staff Engineer, Package Development (DTFS)

Allegro MicroSystems

  • Manila City, Metro Manila Paranaque City, Metro Manila
  • Permanent
  • Full-time
  • 1 month ago
The Allegro team is passionate about providing intelligent solutions that move the world toward a safer and more sustainable future. With more than 30 years of experience developing advanced semiconductor technology, innovation with purpose touches every aspect of our business. From customer engagement and employee recognition to technology advancement and serving the local communities in which we maintain offices, innovation consistently drives our mission and definition of success.JOB RESPONSIBILITIES:Process Set-up and DevelopmentProcess Parameter OptimizationOptimizes process parameters by experimental designs, process variable definitions and robust design engineering for new packages or continuous improvement.Improvement of Existing Methods and Conception of New MethodsConceives, sources out and tests alternative and new methods/processes to improve manufacturability, yield, and quality.Spearheads generation of FMEA for new Assembly processes and reviews until completion of qualification.Equipment Qualification and DevelopmentDesigns and/or qualifies jigs, fixtures, and tools to enhance machine efficiency and improve product quality.Generates and/or reviews equipment specifications and qualification procedures and supporting documents for PAR of new equipment.Spearheads machine qualification and monitoring, and/or conducts equipment buy-off at supplier site. Recommends machine modifications whenever necessary.Material DevelopmentSources out, evaluates and recommends alternative materials to reduce cost, enhance quality, and improve manufacturability.Product DevelopmentDetermines machine and process capability for new products.Ensures that engineering lots for new devices and packages are assembled in conformance to all requirements and process concerns are reported.Cost Reduction and Yield ImprovementPlans, designs, implements and monitors activities geared to improve product and material yield, reduce production cost and/or reduce product reliability defects.Standardization and DocumentationGenerates, interprets, and updates process and material specifications and flowcharts for new package projects.Interprets quality inspection criteria and specifications.Prepares technical reports on the results of evaluations and investigations and presents recommended actions.Coordination/Communication of Process Issues for Improved Quality, Manufacturability and Reliability.Coordinates quality, manufacturability, process control and reliability issues with internal and external customers.Facilitates discussion of material and equipment quality and performance issues with supplier/s.MINIMUM QUALIFICATIONS:Degree in Mechanical/Electrical / Electronics and Communication /Materials / Metallurgical / Chemical / Manufacturing / Industrial Engineering.Subject matter expert with at least 10 years’ experience in a Package Development, New Product Introduction and/or Sustaining role in a semiconductor assembly environment for leadframe and substrate-based packages, including failure modes and failure analysis, covering standard and custom package.Comprehensively perform, review and interpret mold simulations and create/recommend effective solutions to achieve optimum results.Review and interpret POD and tooling designs and create/recommend effective solutions to achieve design intent.Comprehensive knowledge of downstream and upstream Assembly processes that impact the Molding Processes) and can be impacted by the output of the Molding Process, respectively.Comprehensive use of principles of Design for Manufacturability, DFMEA and Design Review for Manufacturability by Failure Modes (DRBFM) or its equivalent.Subject matter expert in the use of statistical methods of experimentation and analysis and their associated application/tools (DOE, SAS-JMP, Minitab, others) to establish and improve Process and Equipment Capability.Comprehensive knowledge and application of the Advance Quality Core tools (Process Flow, FMEA, Control Plan, Process Specifications and Work Instructions)Comprehensive knowledge and application of Problem-Solving Methods and use of the appropriate analytical techniques to establish cost effective and efficient solutions with high level of critical thinking with solution provider mindset.High level of effective written, oral communication, presentation, and training skills.High aptitude in mechanical reasoning and drawing with comprehensive knowledge of dimensioning and tolerancing.Comprehensive use of Continuous Improvement Tools like PDCA, Lean, others.Experience in handling, supervising a technical team and possesses good people skills.

Allegro MicroSystems

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