Senior Engineer, Package Development (CAD)

• Optimizes process parameters by experimental designs, process variable definitions and robust design engineering for new packages or continuous improvement.

• Conceives, sources out and tests alternative and new methods/processes to improve manufacturability, yield, and quality.
• Spearheads generation of FMEA for new Assembly processes and reviews until completion of qualification.

• Designs and/or qualifies jigs, fixtures, and tools to enhance machine efficiency and improve product quality.
• Generates and/or reviews equipment specifications and qualification procedures, and supporting documents for PAR of new equipment.
• Spearheads machine qualification and monitoring, and/or conducts equipment buy-off at supplier site. Recommends machine modifications whenever necessary.

• Sources out, evaluates and recommends alternative materials to reduce cost, enhance quality, and improve manufacturability.

• Determines machine and process capability for new products.
• Ensures that engineering lots for new devices and packages are assembled in conformance to all requirements and process concerns are reported.

• Plans, designs, implements and monitors activities geared to improve product and material yield, reduce production cost and/or reduce product reliability defects.

• Generates, interprets, and updates process and material specifications and flowcharts for new package projects.
• Interprets quality inspection criteria and specifications.
• Prepares technical reports on the results of evaluations and investigations, and presents recommended actions.

• Conducts process training for new Engineers and Technicians.
• Provides initial training to production personnel on new processes.

• Coordinates quality, manufacturability, process control and reliability issues with internal and external customers.
• Facilitates discussion of material and equipment quality and performance issues with supplier/s.

• Degree in Industrial Design, Mechanical/Electrical / Electronics and Communication or related courses
• With at least 5 Years experience of using 2D, 3D and Solid CAD for Product Design and Development preferably in a semiconductor assembly environment for leadframe and substrate-based packages.
• Comprehensive knowledge in reviewing and interpreting POD, tooling designs and drawings to create effective solutions to achieve project and design intent.
• Comprehensive knowledge of downstream and upstream Assembly processes and the impact of the design to the input and output of these processes.
• Comprehensive use of principles of Design for Manufacturability, DFMEA.
• Working knowledge and application of the Advanced Quality Core tools (Process Flow, FMEA, Control Plan)
• Working knowledge and application of Problem-Solving Methods and use of the appropriate analytical techniques to establish cost effective and efficient solutions.
• Effective written, oral communication, presentation skills.
• Critical thinking with solution provider mindset.
• High aptitude in mechanical reasoning and drawing with comprehensive knowledge of dimensioning and tolerancing.
• Working knowledge of Continuous Improvement Tools like PDCA, Lean, others.
• Good people skills.

Allegro MicroSystems